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1 | | | pcb/hdi 2+4+2
Specification: HDI 2+4+2
Detail: Layer-up:2+4+2 Laser hole:L1-L2 L2-L3 L6-L7 L7-L8 CNC hole:L1-L8 L2-L7 L3-L6 Min. hole size:0.1mm£¨by laser£©and 0.3mm£¨by CNC£© Board thickness:0.8mm Min. line width:0.08mm Min. line ***ce:0.075mm Impedance control:45....
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2 | | | pcb/6 layers
Specification: 6 layers pcb
Detail: Layer-up:6 Material:FR-4 Tg170 Surface:ENIG Min hole:0.25mm Board size:326mm*242mm Impedance control:55.0+/- 7.5 Ohm Line width/Line ***ce:4mil/5mil
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3 | | | pcb/hdi 1+1+6+1+1
Specification: HDI 1+1+6+1+1
Detail: Layer-up:1+1+6+1+1 Material:FR-4 high TG Surface:ENIG+OSP Hole:Laser: L1-L2 L2-L3 L8-L9 L9-L10 and CNC: L3-L8 L2-L9 L1-L10 Min. hole:0.1©L£¨by laser)and 0.25©L£¨by CNC£© Board thickness:1mm Min. line width:0.075mm Min....
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4 | | | pcb/hdi 2+6+2
Specification: HDI 2+6+2
Detail: Layer-up:2+6+2 Material:FR408HR Surface:ENIG+OSP Hole:Laser: L1-L2 L2-L3 L8-L9 L9-L10 AND CNC: L1-L10 L2-L9 L3-L8 Min. hole:0.1mm£¨by Laser£©AND 0.25mm£¨by CNC£© Board thickness:1mm Min. line width:0.1mm Min. line ***c...
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